A global interconnect design window for a three-dimensional system-on-a-chip-Reference-Cited by-同舟云学术

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A global interconnect design window for a three-dimensional system-on-a-chip

Published:2001 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461)
language:
Short-container-title:

Author:

Joyner J.W.,Zarkesh-Ha P.,Meindl J.D.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7399/20106/00930044.pdf?arnumber=930044

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