Dielectric-on-Dielectric Achieved on SiO<sub>2</sub> in Preference to W by Water-free Chemical Vapor Depositions with Aniline Passivation-Reference-Cited by-同舟云学术

Dielectric-on-Dielectric Achieved on SiO₂ in Preference to W by Water-free Chemical Vapor Depositions with Aniline Passivation

Published:2023-05-19 Issue:21 Volume:15 Page:26128-26137
ISSN:1944-8244
Container-title:ACS Applied Materials & Interfaces
language:en
Short-container-title:ACS Appl. Mater. Interfaces

Author:

Huang James¹^ORCID,Cho Yunil²^ORCID,Wang Victor¹^ORCID,Zhang Zichen¹^ORCID,Mu Jing¹,Yadav Ajay³,Wong Keith³,Nemani Srinivas³,Yieh Ellie³,Andrew Kummel⁴^ORCID

Affiliation:

1. Materials Science and Engineering, University of California, San Diego, La Jolla California 92093, United States

2. Electrical and Computer Engineering, University of California, San Diego, La Jolla California 92093, United States

3. Applied Materials, Inc., Santa Clara, California 95054, United States

4. Department of Chemistry and Biochemistry, University of California, San Diego, La Jolla California 92093, United States

Funder

Applied Materials

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Link

https://pubs.acs.org/doi/pdf/10.1021/acsami.3c02278

Reference38 articles.

1. Impact of three-dimensional architectures on interconnects in gigascale integration

2. Joyner, J. W.; Zarkesh-Ha, P.; Meindl, J. A Stochastic Global Net-Length Distribution for A Three-Dimensional System-On-A-Chip (3D-SoC). 14th Annual IEEE International ASIC/SOC Conference; IEEE Cat. no. 01TH8558, 2001; pp 147–151.

3. Nahman, A.; Fan, A.; Chung, J.; Reif, R. Wire-Length Distribution of Three-Dimensional Integrated Circuits. 1999 IEEE International Interconnect Technology Conference (Cat. No. 99EX247), 1999; pp 233–235.

4. System-level performance evaluation of three-dimensional integrated circuits

5. Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Area selective deposition for bottom-up atomic-scale manufacturing;International Journal of Machine Tools and Manufacture;2024-06

2. Low-k SiO_x/AlO_x Nanolaminate Dielectric on Dielectric Achieved by Hybrid Pulsed Chemical Vapor Deposition;ACS Applied Materials & Interfaces;2023-11-18