Optimized integrated copper gap-fill approaches for 2x flash devices-Reference-Cited by-同舟云学术

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Optimized integrated copper gap-fill approaches for 2x flash devices

Published:2009-06 Issue: Volume: Page:
ISSN:
Container-title:2009 IEEE International Interconnect Technology Conference
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Author:

Ma Paul,Luo Qian,Sundarrajan Arvind,Lu Jiang,Aubuchon Joseph,Tseng Jennifer,Kumar Niranjan,Okazaki Motoya,Wang Yuchun,Wang You,Chen Yufei,Naik Mehul,Emesh Ismail,Narasimhan Murali

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5069981/5090321/05090334.pdf?arnumber=5090334

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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3. CMP Development for Ru Liner Structures beyond 14nm;ECS Journal of Solid State Science and Technology;2018

4. Citric Acid as a Complexing Agent in Chemical Mechanical Polishing Slurries for Cobalt Films for Interconnect Applications;ECS Journal of Solid State Science and Technology;2017

5. A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization;Microelectronic Engineering;2016-08

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