Author:
Kassakian J.G.,Perreault D.J.
Cited by
51 articles.
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2. Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process;Journal of Materials Science: Materials in Electronics;2023-06
3. Data Exchange Interfaces in Automotive SOA;2022 45th Jubilee International Convention on Information, Communication and Electronic Technology (MIPRO);2022-05-23
4. Microstructure evolution and mechanical properties of Cu-Sn intermetallic joints subjected to high-temperature aging;Materials Characterization;2022-04
5. Media Clock Recovery Over Ethernet Using IEEE 1722 on an FPGA;2021 International Conference on Electrical, Computer and Energy Technologies (ICECET);2021-12-09