Zigzag-Shaped Coil Array Structure for Wireless Chip-to-Chip Communication Applications-Reference-Cited by-同舟云学术

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Zigzag-Shaped Coil Array Structure for Wireless Chip-to-Chip Communication Applications

Published:2014-09 Issue:9 Volume:61 Page:3245-3251
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Changhyun Lee ,Jonghoon Park ^ORCID,Changkun Park

Funder

Basic Science Research Program through the Ministry of Education, Science and Technology, National Research Foundation of Korea

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/6880431/06849986.pdf?arnumber=6849986

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. TCI Tester: A Chip Tester for Inductive Coupling Wireless Through-Chip Interface;Journal of Low Power Electronics and Applications;2023-08-04

2. Wireless Transceiver for Three-Dimensional Integrated Circuits Using a Ring Oscillator;Journal of Circuits, Systems and Computers;2019-12-09

3. Transceiver for Wireless Power Transfer Using a Cross-Coupled Oscillator for a Wireless On-Wafer Test;IEEE Transactions on Instrumentation and Measurement;2017-08

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