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The Impact of On-Chip Interconnections on CMOS RF Integrated Circuits

  • Published:2009-09 Issue:9 Volume:56 Page:1882-1890
  • ISSN:0018-9383
  • Container-title:IEEE Transactions on Electron Devices
  • language:
  • Short-container-title:IEEE Trans. Electron Devices

Author:

El-Desouki Munir M.,Abdelsayed Samar M.,Deen M. Jamal,Nikolova Natalia K.,Haddara Yaser M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Review of Variable Line Width Single Layer and Multi-Layer on-Chip Inductor;2023 International Conference on Innovative Data Communication Technologies and Application (ICIDCA);2023-03-14

2. A comparison of three‐dimensional electromagnetic and RC parasitic extraction analysis of mm‐wave on‐chip passives in SiGe BiCMOS low‐noise amplifiers;International Journal of RF and Microwave Computer-Aided Engineering;2019-12-13

3. A 2.4 GHz CMOS Class-F Power Amplifier With Reconfigurable Load-Impedance Matching;IEEE Transactions on Circuits and Systems I: Regular Papers;2019-01

4. High-Performance CMOS Power Amplifier With Improved Envelope Tracking Supply Modulator;IEEE Transactions on Microwave Theory and Techniques;2016

5. Analysis and Equivalent-Circuit Model for CMOS On-Chip Multiple Coupled Inductors in the Millimeter-Wave Region;IEEE Transactions on Electron Devices;2015-12
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