Author:
Yeo Alfred,Lam Wong Foo,Lee Charles
Cited by
3 articles.
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1. Electrical diagnostics of passive components failure during reliability testing;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25
2. Copper pillar bump design optimization for lead free flip-chip packaging;Journal of Materials Science: Materials in Electronics;2009-05-15
3. Consideration of temperature and current stress testing on flip chip solder interconnects;Microelectronics Reliability;2008-11