Author:
Yeo Alfred,Ebersberger Bernd,Lee Charles
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Flip chip solder joint reliability analysis using viscoplastic and elastic–plastic-creep constitutive models;Yeo;IEEE Trans Compon Packag Technol,2006
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4. Yeo A, Wong FL, Lee C. Development of novel joint resistance modeling technique for flip chip interconnection systems. In: Proceedings of 31st IEMT, Putrajaya, Malaysia, November 2006. p. 115–9.
5. Geometrical effect of bump resistance for flip-chip solder joints: finite-element modeling and experimental results;Liang;J Electron Mater,2006
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