1. Defect Isolation of Functional Failed 3D NAND Device Memory Using Memory Tester and Test Bench with OBIRCH;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
2. Thermal Sensitivity Mapping with OBIRCH;2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA);2023-07-24
3. Inkjet-printed electrical interconnects for high resolution integrated circuit diagnostics;Communications Engineering;2023-05-02
4. Nanoscale Analysis of Breakdown Induced Crack Propagation in DTSCR Devices;2022 IEEE International Reliability Physics Symposium (IRPS);2022-03