Low-temperature and rapid direct bonding through nano-Ag coating for high-temperature and high-power density electronics packaging-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Low-temperature and rapid direct bonding through nano-Ag coating for high-temperature and high-power density electronics packaging

Published:2022-11-09 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE CPMT Symposium Japan (ICSJ)
language:
Short-container-title:

Author:

Liu Canyu¹,Liu Allan²,Zhou Zhaoxia³,Liu Changqing¹

Affiliation:

1. Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University,Leicestershire,UK

2. Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University

3. Loughborough Materials Characterization Centre, Loughborough University,Leicestershire,UK

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10034668/10034662/10034730.pdf?arnumber=10034730

Reference10 articles.

1. Microstructural evolution of SiC joints soldered using Zn–Al filler metals with the assistance of ultrasound

2. Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration

3. Zn-Al based alloys as Pb-free solders for die attach

4. Thermo-elasto-plastic phase-field modelling of mechanical behaviours of sintered nano-silver with randomly distributed micro-pores

5. Ultrasonic-assisted nano Ag-AI alloy sintering to enable high-temperature electronic interconnections;liu;Proc Electronic Components and Technology Conf,0

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP