Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration

Author:

Chang Leh-Ping,Wang Jian-Jie,Hung Tzu-Heng,Chen Kuan-Neng,Ouyang Fan-Yi

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference31 articles.

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2. C.S. Tan, R.J. Gutmann, L.R. Reif, Wafer level 3-D ICs process technology, Springer Science & Business Media, 2009.

3. Development of advanced all-SiC power modules;Liang;IEEE Trans. Power Electron.,2013

4. M. Knoerr, S. Kraft, A. Schletz, Reliability assessment of sintered nano-silver die attachment for power semiconductors, in: 2010 12th Electronics Packaging Technology Conference, IEEE, 2010, pp. 56-61.

5. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011

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