Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly-Reference-Cited by-同舟云学术

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Elimination of Die-Pop Defect by Vacuum Reflow for Ultrathin Die With Warpage in Semiconductor Packaging Assembly

Published:2023 Issue: Volume: Page:1-8
ISSN:0018-9529
Container-title:IEEE Transactions on Reliability
language:
Short-container-title:IEEE Trans. Rel.

Author:

Yeo Siang Miang¹^ORCID,Yow Ho Kwang²^ORCID,Yeoh Keat Hoe²^ORCID,Mohamad Azenal Siti Nur Farhana¹

Affiliation:

1. Amkor Technology, Inc., Telok Panglima Garang, Malaysia

2. Department of Electrical and Electronics Engineering, Lee Kong Chian Faculty of Engineering and Science and the Centre for Photonics and Advanced Material Research, Universiti Tunku Abdul Rahman, Kajang, Malaysia

Funder

Tin Industry

Ministry of Energy and Natural Resources

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality

Link

http://xplorestaging.ieee.org/ielx7/24/4378406/10190228.pdf?arnumber=10190228

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ultrathin Small Outline Package Key Techniques for High-Speed Chips with Multi-Leads;Micromachines;2024-08-13

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