Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling-Reference-Cited by-同舟云学术

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Integration of Ball Lens in Through-Package Via to Enable Photonic Chip-to-Board Coupling

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Mangal Nivesh,Missinne Jeroen,Van Campenhout Joris,Van Steenberge Geert,Snyder Brad

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429688.pdf?arnumber=8429688

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Ball Lens Embedded Through-Package Via To Enable Backside Coupling Between Silicon Photonics Interposer and Board-Level Interconnects;Journal of Lightwave Technology;2020-04-15

2. Expanded-Beam Backside Coupling Interface for Alignment-Tolerant Packaging of Silicon Photonics;IEEE Journal of Selected Topics in Quantum Electronics;2020-03

3. Performance Evaluation of Backside Emitting O-Band Grating Couplers for 100-$\mu$m-Thick Silicon Photonics Interposers;IEEE Photonics Journal;2019-06

4. Through-substrate coupling elements for silicon-photonics-based short-reach optical interconnects;Optical Interconnects XIX;2019-03-04

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