Ball Lens Embedded Through-Package Via To Enable Backside Coupling Between Silicon Photonics Interposer and Board-Level Interconnects-Reference-Cited by-同舟云学术

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Ball Lens Embedded Through-Package Via To Enable Backside Coupling Between Silicon Photonics Interposer and Board-Level Interconnects

Published:2020-04-15 Issue:8 Volume:38 Page:2360-2369
ISSN:0733-8724
Container-title:Journal of Lightwave Technology
language:
Short-container-title:J. Lightwave Technol.

Author:

Mangal Nivesh^ORCID,Missinne Jeroen^ORCID,Van Campenhout Joris^ORCID,Snyder Bradley^ORCID,Van Steenberge Geert^ORCID

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Atomic and Molecular Physics, and Optics

Link

http://xplorestaging.ieee.org/ielx7/50/9059053/08959219.pdf?arnumber=8959219

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections;Optical Interconnects XXIV;2024-03-11

2. Photonic Integrated Circuit Based Temperature Sensor for Out-of-Autoclave Composite Parts Production Monitoring;Sensors;2023-09-08

3. Compact packaged silicon photonic Bragg grating sensor based on a ball lens interface;Optics & Laser Technology;2023-01

4. Monolithic integration of microlenses on the backside of a silicon photonics chip for expanded beam coupling;Optics Express;2021-02-25

5. Laser Written Glass Interposer for Fiber Coupling to Silicon Photonic Integrated Circuits;IEEE Photonics Journal;2021-02

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