Ultra Fine RDL Structure Fabrication Using Alternative Patterning and Bottom-Up Plating Processes
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429530.pdf?arnumber=8429530
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Ultrashort Pulsed Laser Drilling of Printed Circuit Board Materials;Materials;2022-05-31
2. Fabrication Process for On-Board Geometries Using a Polymer Composite-Based Selective Metallization for Next-Generation Electronics Packaging;Processes;2021-09-10
3. An All-Wet, Low Cost RDL Fabrication Process with Electroless Plated Seed/Barrier Layers;2021 IEEE International Interconnect Technology Conference (IITC);2021-07-06
4. Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density;Materials Chemistry and Physics;2020-12
5. Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-09
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