Study of Thermal Aging Behavior of Epoxy Molding Compound for Applications in Harsh Environments-Reference-Cited by-同舟云学术

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Study of Thermal Aging Behavior of Epoxy Molding Compound for Applications in Harsh Environments

Published:2019-05 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
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Author:

Inamdar Adwait,Prisacaru Alexandru,Fleischman Martin,Franieck Erick,Gromala Przemyslaw,Veres Agnes,Nemeth Csaba,Yang Yu-Hsiang,Han Bongtae

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8795274/8811008/08811113.pdf?arnumber=8811113

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Material Aging on the Reliability of an Automotive BGA Device Under Temperature Cycling Test Conditions;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Prediction of High-Speed Oscillator Frequency Drift Under Package Level Reliability Tests;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

3. THz-TDS for IC packaging material changes detection under real-world conditions;Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII;2024-03-11

4. An Outlook on Power Electronics Reliability and Reliability Monitoring;Recent Advances in Microelectronics Reliability;2024

5. Polymer‐based nanocomposites in semiconductor packaging;IET Nanodielectrics;2023-04-18

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