Author:
Lee Chang-Chun,Liou Yan-Yu,Huang Pei-Chen,Hsu Fussen,Lin Puru Bruce,Ko Cheng-Ta,Chen Yu-Hua
Cited by
6 articles.
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1. Crazing of Photoimageable Dielectric (PID) in Fan-Out Panel Level Packaging (FOPLP);2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. Combining Process Modeling and Machine Learning Technology to Predict the Warpage of the Panel-Level Packaging After Debonding;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
3. The Effect of Geometric and Material Uncertainty on Debonding Warpage in Fan-Out Panel Level Packaging;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
4. Warpage Estimation and Demonstration of Panel-Level Fan-Out Packaging With Cu Pillars Applied on a Highly Integrated Architecture;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-04
5. Using Extra Trees Machine Learning Algorithm to Predict the Asymmetric Warpage Geometry of Panel Level Packaging;2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2022-10-26