Author:
Vladimirova Kremena,Widiez Julie,Letowski Bastien,Perreau Pierre,Enyedi Gregory,Coudrain Perceval,Rouger Nicolas,Crebier Jean-Christophe
Cited by
1 articles.
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1. Review of Packaging Schemes for Power Module;IEEE Journal of Emerging and Selected Topics in Power Electronics;2020-03