Review of Packaging Schemes for Power Module-Reference-Cited by-同舟云学术

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Review of Packaging Schemes for Power Module

Published:2020-03 Issue:1 Volume:8 Page:223-238
ISSN:2168-6777
Container-title:IEEE Journal of Emerging and Selected Topics in Power Electronics
language:
Short-container-title:IEEE J. Emerg. Sel. Topics Power Electron.

Author:

Hou Fengze^ORCID,Wang Wenbo,Cao Liqiang,Li Jun,Su Meiying,Lin Tingyu,Zhang Guoqi,Ferreira Braham

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology

Link

http://xplorestaging.ieee.org/ielx7/6245517/8977415/08869891.pdf?arnumber=8869891

Cited by 67 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Opportunities and Challenges of Pressure Contact Packaging for Wide Bandgap Power Modules;IEEE Transactions on Power Electronics;2024-02

2. Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules;Case Studies in Thermal Engineering;2023-12

3. A Double-Sided Cooled Split-Phase SiC Power Module With Fuzz Button Interposer;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-10

4. Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview;IEEE Transactions on Power Electronics;2023-08

5. Thermal Impedance Computation of a SiC Power Module for Traction Inverter in Electric Vehicle Applications;2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE);2023-07-17

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