Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D)-Reference-Cited by-同舟云学术

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Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D)

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Huang Chen-Yu,Hsu Yuan-Hung,Lu Ying-Ju,Yu Kuo-Hua,Tsai Wen-Shan,Lin Chang-Fu,Chung C. Key

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429613.pdf?arnumber=8429613

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