Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects-Reference-Cited by-同舟云学术

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Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects

Published:2018-05 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Author:

Hanna Amir,Alam Arsalan,Fukushima Takafumi,Moran Steven,Whitehead William,Jangam Siva Chandra,Pal Saptadeep,Ezhilarasu Goutham,Irwin Randall,Bajwa Adeel,Iyer Subramanian

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429742.pdf?arnumber=8429742

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An active, high bandwidth, flexible connector for large area computational systems;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Bendability enhancement of 3D interconnections with out-of-plane corrugation for flexible hybrid electronics;Japanese Journal of Applied Physics;2024-04-01

3. Stretchable silicon array with stretchability at 66.1% ± 2.9% and silicon areal coverage of 71.5% enabled by wafer-level microfabrication strategy;Applied Physics Letters;2024-01-08

4. 3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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