Cu-In Fine-Pitch-Interconnects with Enhanced Shear Strength
Author:
Affiliation:
1. Inst. of Electron. Packaging Technol., Tech. Univ. Dresden, Dresden, Germany
2. Fraunhofer Inst. for Reliability & Microintegration IZM, Moritzburg, Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/8415930/8429093/08429638.pdf?arnumber=8429638
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Cu nanowire fine-pitch joints for next gen heterogeneous chiplet integration;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Fine-Pitch Copper Nanowire Interconnects for 2.5/3D System Integration;Journal of Electronic Materials;2024-05-20
3. Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate;Materials;2023-09-18
4. Metallurgical aspects and joint properties of Cu-Ni-In-Cu fine-pitch interconnects for 3D integration;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
5. Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing;Journal of Materials Research and Technology;2020-11
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