Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing-Reference-Cited by-同舟云学术

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Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing

Published:2020-11 Issue:6 Volume:9 Page:12946-12954
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Hung H.T.^ORCID,Lee P.T.^ORCID,Tsai C.H.,Kao C.R.^ORCID

Funder

Ministry of Education, Science and Technology

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference24 articles.

1. Future internet: the internet of things;Lu,2010

2. Internet of things: architectures, protocols, and applications;Sethi;J Electr Comput Eng,2017

3. Heterogeneous integration challenges within wafer level fan-out SiP for wearables and IoT;Martins,2018

4. Heterogeneous integration for performance and scaling;Iyer,2016

5. Review of low-temperature bonding technologies and their application in optoelectronic devices;Higurashi;Electron Commun Jpn,2016

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1. Diffusion and marker experiments for the newly discovered CuIn2 compound;Materials Characterization;2024-11

2. Phase Equilibria of the Binary Ag-In System;Journal of Phase Equilibria and Diffusion;2024-07-17

3. Focused ion beam-scanning electron microscopy provides novel insights of drug delivery phenomena;Journal of Controlled Release;2024-02

4. Microstructural observation of Bi67In reacting with Cu for microelectronic interconnects;Journal of the Taiwan Institute of Chemical Engineers;2023-10

5. Long-Term Aging Study on the Solid State Interfacial Reactions of In on Cu Substrate;Materials;2023-09-18

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