Dynamic bending test analysis of inkjet-printed conductors on flexible substrates-Reference-Cited by-同舟云学术

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Dynamic bending test analysis of inkjet-printed conductors on flexible substrates

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 62nd Electronic Components and Technology Conference
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Author:

Halonen Eerik,Halme Aki,Karinsalo Tapio,Iso-Ketola Pekka,Mantysalo Matti,Makinen Riku

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6241679/6248788/06248810.pdf?arnumber=6248810

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Test of Inkjet-Printable Silver Conductive Ink;Key Engineering Materials;2023-05-19

2. Cyclic Bending Effects on Resistance of Screen-Printed Silver Conductors;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-11

3. Extracting RLC Parasitics From a Flexible Electronic Hybrid Assembly Using On-Chip ESD Protection Circuits;IEEE Transactions on Circuits and Systems I: Regular Papers;2021-10

4. A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-11

5. Bending reliability of screen-printed vias for a flexible energy module;npj Flexible Electronics;2020-09-18

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