Author:
Liu Meng-Hsiang,Vaisband Boris,Hanna Amir,Luo Yandong,Wan Zhe,Iyer Subramanian S.
Cited by
10 articles.
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1. Wafer-Scale Computing: Advancements, Challenges, and Future Perspectives [Feature];IEEE Circuits and Systems Magazine;2024
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3. Power Delivery for Ultra-Large-Scale Applications on Si-IF;2022 IEEE International Symposium on Circuits and Systems (ISCAS);2022-05-28
4. Wafer‐Scale Integration;Wiley Encyclopedia of Electrical and Electronics Engineering;2022-02-17
5. Flexible Connectors and PCB Segmentation for Signaling and Power Delivery in Wafer-Scale Systems;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06