Heterogeneous Integration at Scale
Author:
Publisher
Wiley
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/9781119869610.ch1
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4. A. A.Bajwa S.Jangam S.Pal N.Marathe T.Bai T.Fukushima M.Goorsky andS. S.Iyer “Heterogeneous integration at fine pitch (≤10 µm) using thermal compression bonding ” inProceedings of the IEEE International Electronic Components and Technology Conference pp.1276–1284 May2017.
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