Author:
Tsao P. H.,Chen T. M.,Kuo Y. L.,Kuo C. M.,Hsu Steven,Lii M. J.,Chu L. H.
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Innovative reliability solution for WLCSP packages;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03
2. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
3. Fan-In Wafer/Panel-Level Chip-Scale Packages;Semiconductor Advanced Packaging;2021