Measurement of Temperature and Humidity Dependence of Automotive-Grade Interconnects
Author:
Affiliation:
1. Robert Bosch GmbH,Stuttgart,Germany
2. Institute of Electromagnetic Theory, Hamburg University of Technology (TUHH),Hamburg,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10145490/10145514/10145521.pdf?arnumber=10145521
Reference20 articles.
1. Automotive Ethernet Architecture for the Connected Dacia Logan Electric Vehicle
2. The Evolution of Automotive Interconnect and Physical-Layer Technologies: Ubiquitous pathways enabling intelligent vehicles
3. IEEE Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects at Frequencies up to 50 GHz
4. Impact of Use Conditions on Dielectric and Conductor Material Models for High-Speed Package Interconnects
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