Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
16 articles.
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1. Quantifying Uncertainties in the Correlation of Simulations and Measurements Using the IEEE EPS Packaging Benchmark Suite;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. High Frequency Assessment of Djordjevic-Sarkar Model for Low Loss Package Dielectrics;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Package Technology Enabling for 224 Gbps Electrical Signaling;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15
4. Measurement of Temperature and Humidity Dependence of Automotive-Grade Interconnects;2023 IEEE 27th Workshop on Signal and Power Integrity (SPI);2023-05-07
5. 2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12