An Alternative approach to Buffer Insertion for Delay and Power Reduction in VLSI Interconnects

Author:

Saini Sandeep,Kumar A. Mahesh,Veeramachaneni Sreehari,Srinivas M.B.

Publisher

IEEE

Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Digital Backend Optimization Techniques for Post-Route and Sign-Off Challenges in ASIC Design;Proceedings of Second International Conference on Computational Electronics for Wireless Communications;2023

2. Design and performance analysis of buffer inserted on-chip global nano interconnects in VDSM technologies;Nanotechnology for Environmental Engineering;2022-05-11

3. Optimized Crosstalk Circuit for Long Wire Copper Interconnects using 45nm CMOS Inverter;2020 IEEE International Women in Engineering (WIE) Conference on Electrical and Computer Engineering (WIECON-ECE);2020-12-26

4. Performance analysis of carbon nanotubes forfuture highspeed VLSI on-chip interconnect applications;JOURNAL OF MECHANICS OF CONTINUA AND MATHEMATICAL SCIENCES;2019-08-28

5. Comparative Performance Analysis of Different High-Speed Buffer Drivers Using BiCMOS Technology and MVL Logic;Lecture Notes in Electrical Engineering;2019

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