Reliability and Failure Analysis of Lead-Free Solder Joints for PBGA Package Under a Cyclic Bending Load
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx5/6144/4531641/04520269.pdf?arnumber=4520269
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