Sliding Interconnection for Flexible Electronics with a Solution‐Processed Diffusion Barrier against a Corrosive Liquid Metal-Reference-Cited by-同舟云学术

Sliding Interconnection for Flexible Electronics with a Solution‐Processed Diffusion Barrier against a Corrosive Liquid Metal

Author:

Shin Dong‐Youn¹^ORCID,Baek Sang‐Yup¹,Song Hyung‐Jun²^ORCID,Lee Jeong In³,Kang Gi‐Hwan³

Affiliation:

1. Department of Graphic Arts EngineeringPukyong National University 45 Yongso‐ro, Nam‐gu Busan 48513 Republic of Korea

2. Department of Safety EngineeringSeoul National University of Science and Technology 232 Gongneung‐ro, Nowon‐gu Seoul 01811 Republic of Korea

3. Photovoltaic LaboratoryKorea Institute of Energy Research 152 Gajeong‐ro, Yuseong‐gu Daejeon 34129 Republic of Korea

Funder

Korea Institute of Energy Technology Evaluation and Planning

National Research Foundation of Korea

Publisher

Wiley

Subject

Electronic, Optical and Magnetic Materials

Link

Reference49 articles.

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