Author:
Lall P.,Panchagade D.R.,Liu Y.,Johnson R.W.,Suhling J.C.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
28 articles.
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2. Printed Circuit Board Orthotropic Material Calibration for Static and Dynamic Loading;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
3. Finite element analysis of underfill effect on the CBGA package reliability under thermal cycling;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10
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5. Interfacial Fracture Toughness of PCB/Epoxy Interfaces Under Three Point and Four Point Loading with Sustained High Temperature Exposure;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01