An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene-Reference-Cited by-同舟云学术

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An ultra-thin and highly flexible multilayer Printed Circuit Board based on Parylene

Published:2021-04-27 Issue: Volume: Page:
ISSN:
Container-title:2021 Smart Systems Integration (SSI)
language:
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Author:

Selbmann Franz¹,Roscher Frank¹,de Souza Tortato Felipe¹,Wiemer Maik¹,Otto Thomas²,Joseph Yvonne³

Affiliation:

1. Fraunhofer ENAS,Dept. System Packaging,Chemnitz,Germany

2. Fraunhofer ENAS,Chemnitz,Germany

3. TU Bergakademie Freiberg,Institute for Electronic and Sensor Materials,Freiberg,Germany

Funder

European Social Fund

Ministry of Education

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9466933/9466951/09466996.pdf?arnumber=9466996

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Hot Embossing to Fabricate Parylene-Based Microstructures and Its Impact on the Material Properties;Polymers;2024-08-03

2. Hybrid Systems in Foil: Merging the Best of Two Worlds;IEEE Electron Devices Magazine;2024-06

3. Functional materials for powering and implementing next-generation miniature sensors;Materials Today;2023-10

4. Greenhouse Monitoring with Biocompatible Humidity Sensor for Smart Farming;2023 Smart Systems Integration Conference and Exhibition (SSI);2023-03-28

5. Paradigm Changing Integration Technology for the Production of Flexible Electronics by Transferring Structures, Dies and Electrical Components from Rigid to Flexible Substrates;Micromachines;2023-02-10

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