Fluxless Flip-Chip Solder Joint Fabrication Using Electroplated Sn-Rich Sn-Au Structures
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx5/6040/34915/01667866.pdf?arnumber=1667866
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Dual-cluster interpretation of Au–Sn binary eutectics and solders;AIP Advances;2024-03-01
2. Wafer-Level Low-Temperature Solid-Liquid Inter-Diffusion Bonding With Thin Au-Sn Layers for MEMS Encapsulation;Journal of Microelectromechanical Systems;2021-02
3. Novel Au-Based Solder Alloys: A Potential Answer for Electrical Packaging Problem;Advances in Materials Science and Engineering;2020-05-26
4. Application of AlMgGaLi foil for joining copper to SiCp/Al-MMCs for high-temperature and high-power electronics;Applied Physics A;2019-08
5. Composition design of Sn-rich Sn–Au–Ag solders using cluster-plus-glue-atom model;Journal of Materials Science: Materials in Electronics;2017-04-27
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