Flip-chip on flex integrated power electronics modules for high-density power integration
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx5/6040/26984/01198942.pdf?arnumber=1198942
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles;IEEE Transactions on Device and Materials Reliability;2023-06
2. Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module;IEEE Journal of Emerging and Selected Topics in Power Electronics;2020-03
3. A High-Performance Embedded SiC Power Module Based on a DBC-Stacked Hybrid Packaging Structure;IEEE Journal of Emerging and Selected Topics in Power Electronics;2020-03
4. Flexible PCB-Based 3-D Integrated SiC Half-Bridge Power Module With Three-Sided Cooling Using Ultralow Inductive Hybrid Packaging Structure;IEEE Transactions on Power Electronics;2019-06
5. A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials;Applied Thermal Engineering;2018-09
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