1. Chip-scale packaging of power devices and its application in integrated power electronics modules;Liu;IEEE Trans. Adv. Packag.,2001
2. Chip Scale Package (CSP): Design, Materials, Processes, Reliability, and Applications. Electronic Packaging and Interconnection Series;Lau,1999
3. Low Voltage Power MOSFETs: Design, Performance and Applications. Springer Briefs in Applied Sciences and Technology;Korec,2011
4. Flip-chip on flex integrated power electronics modules for high-density power integration;Bai;IEEE Trans. Adv. Packag.,2003
5. Effects of voids on mechanical and thermal properties of the die attach solder layer used in high-power led chip-scale packages;Jiang;IEEE Trans. Compon. Packag. Manuf. Technol.,2018