A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication-Reference-Cited by-同舟云学术

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A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication

Published:2007-08 Issue:3 Volume:30 Page:377-383
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Chang Shu-Ming,Cheng Chih-Yuan,Shen Li-Cheng,Chiang Kuo-Ning,Hwang Yu-Jiau,Chen Yu-Fang,Ko Cheng-Ta,Chen Kuo-Chyuan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4285919/04285924.pdf?arnumber=4285924

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