Suppression of EMI and Electromagnetic Noise in Packages Using Embedded Capacitance and Miniaturized Electromagnetic Bandgap Structures With High-k Dielectrics-Reference-Cited by-同舟云学术

Suppression of EMI and Electromagnetic Noise in Packages Using Embedded Capacitance and Miniaturized Electromagnetic Bandgap Structures With High-k Dielectrics

Published:2007-11 Issue:4 Volume:30 Page:776-788
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Mohajer-Iravani B.,Ramahi O.M.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4366166/04366180.pdf?arnumber=4366180

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