Flip-Chip Bonding of MEMS Scanner for Laser Display Using Electroplated AuSn Solder Bump-Reference-Cited by-同舟云学术

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Flip-Chip Bonding of MEMS Scanner for Laser Display Using Electroplated AuSn Solder Bump

Published:2007-02 Issue:1 Volume:30 Page:27-33
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Chu Kun-Mo,Choi Won-Kyoung,Ko Young-Chul,Lee Jin-Ho,Park Hyo-Hoon,Jeon Duk Young

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4084580/04084586.pdf?arnumber=4084586

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Growth of intermetallic compounds and their reinforcement on CrCoNi/Au80Sn20 soldering interfaces;Intermetallics;2024-01

2. Design and verification of modular and reusable aging test system for high power SIP;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

3. Electrode Formation Using Electrodeposition and Direct Bonding for 3D Integration;Novel Structured Metallic and Inorganic Materials;2019

4. Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer;Sensors;2015-09-02

5. AuSn20 Eutectic Electrodeposition through Alternative Complexing of Pyrophosphoric Acid: Insights from Electrochemical and DFT Methods;The Journal of Physical Chemistry C;2013-10-08

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