Design and verification of modular and reusable aging test system for high power SIP
Author:
Affiliation:
1. CKS Integrated Circuit Co., Ltd,Microsystem Center,Wuxi,China
2. Xidian University,School of Electro-Mechanical Engineering,Xi'an,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873206.pdf?arnumber=9873206
Reference13 articles.
1. Example Analysis of Design Method to Improve the Reliability of Aging Test Board [J];zhen;Electronic Quality,2020
2. Introduction and Inspection of Defects in Aging Plate [J];jun;Journal of Electronic Packaging,2019
3. Design of Intelligent Temperature Controller Based on FPGA [J];jiashun;Journal of Electronic Packaging,2020
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