Handheld Use Condition-Based Bend Test Development-Reference-Cited by-同舟云学术

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Handheld Use Condition-Based Bend Test Development

Published:2006-05 Issue:2 Volume:29 Page:240-249
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:en
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Mercado L.L.,Phillips B.,Sahasrabudhe S.,Sedillo J.P.,Bray D.,Monroe E.,Lee K.J.,Lo G.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/34176/01629166.pdf?arnumber=1629166

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design of Rigid-Flex PCB Robotics Leveraging Validated Finite Element Simulations;2022 IEEE Aerospace Conference (AERO);2022-03-05

2. The reliability of component boards studied with different shock impact repetition frequencies;Microelectronics Reliability;2012-07

3. Mechanical behavior of solder joints under dynamic four-point impact bending;Microelectronics Reliability;2011-05

4. The Consolidated Simulation Environment for The Cellular Phone Terminals Development;Journal of Japan Institute of Electronics Packaging;2010

5. Finite element model verification for packaged printed circuit board by experimental modal analysis;Microelectronics Reliability;2008-11

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