An improvement of thermal conductivity of underfill materials for flip-chip packages-Reference-Cited by-同舟云学术

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An improvement of thermal conductivity of underfill materials for flip-chip packages

Published:2003-02 Issue:1 Volume:26 Page:25-32
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:en
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Li H.,Jacob K.I.,Wong C.P.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/26984/01198938.pdf?arnumber=1198938

Cited by 49 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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