150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects-Reference-Cited by-同舟云学术

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150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects

Published:2008-02 Issue:1 Volume:31 Page:58-65
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Seung Wook Yoon ,Thew S.M.L.,Lim S.Y.L.,Wai Yin Hnin ,Tai Chong Chai ,Viswanath A.G.K.,Kripesh V.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4447317/04437765.pdf?arnumber=4437765

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Solutions Strategies for Die Shift Problem in Wafer Level Compression Molding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-04

2. Design and Development of Multi-Die Laterally Placed and Vertically Stacked Embedded Micro-Wafer-Level Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2011-01

3. Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package;Microelectronics Reliability;2010-07

4. Low-k compatible all-copper flip-chip connections;Microelectronic Engineering;2009-03

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