Integration technologies for a medium voltage modular multi-level converter with hot swap capability-Reference-Cited by-同舟云学术

Integration technologies for a medium voltage modular multi-level converter with hot swap capability

Published:2015-09 Issue: Volume: Page:
ISSN:
Container-title:2015 IEEE Energy Conversion Congress and Exposition (ECCE)
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Author:

Cottet Didier,Agostini Francesco,Gradinger Thomas,Velthuis Rudi,Wunsch Bernhard,Baumann David,Gerig Willi,Ruetschi Andrea,Dzung Dacfey,Vefling Harald,Vallestad Anne Elisabeth,Orfanus Dalimir,Indergaard Reidar,Wien Tormod,van der Merwe Wim

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7298093/7309651/07310295.pdf?arnumber=7310295

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