High-Speed and Low-Latency Transmission by Millimeter-Wave Digital Wireless System for Si-IGBT/SiC-MOSFET Driver Control-Reference-Cited by-同舟云学术

High-Speed and Low-Latency Transmission by Millimeter-Wave Digital Wireless System for Si-IGBT/SiC-MOSFET Driver Control

Published:2023-05-01 Issue:3 Volume:12 Page:351-356
ISSN:2187-1094
Container-title:IEEJ Journal of Industry Applications
language:en
Short-container-title:IEEJ Journal IA

Author:

Akita Koji¹,Tsutsumi Yukako¹,Kitagawa Hiroyuki¹,Suzuki Kentaro²,Saito Ryosuke²,Tawada Yoshihiro³

Affiliation:

1. Corporate Research & Development center, Toshiba Corporation

2. Infrastructure Systems Research and Development Center, Toshiba Infrastructure Systems & Solutions Corporation

3. Power Electronics Systems Division, Toshiba Mitsubishi-Electric Industrial Systems Corporation

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Mechanical Engineering,Energy Engineering and Power Technology,Automotive Engineering

Link

https://www.jstage.jst.go.jp/article/ieejjia/12/3/12_22007552/_pdf

Reference8 articles.

1. (1) Y. Tsutsumi, K. Akita, H. Kitagawa, K. Suzuki, R. Saito, and Y. Tawada: “High-Speed and Low-Latency Transmission by Millimeter-Wave Digital Wireless System for Si-IGBT/SiC-MOSFET Driver Control”, International Power Electronics Conference (2022)

2. (2) S. Bréhaut and F. Costa: “Gate driving of a 3.3kV IGBT chopper by an 8 bits encoded wireless transmission”, in Power Conversion and Intelligent Motion (2006)

3. (3) C. Batard, G. Andrieux, N. Ginot, and M. A. Mannah: “Wireless Transmission of IGBT Driver Control”, in IEEE Applied Power Electronics Conference (2009)

4. (4) S. Bréhaut, F. Costa, M. Tukuda, and I. Omura: “Gate driving of high power IGBT by wireless transmission”, in CES/IEEE 5th International Power Electronics and Motion Control Conference (2006)

5. (5) D. Cottet, F. Agostini, T. Gradinger, R. Velthuis, B. Wunsch, D. Baumann, W. Gerig, A. Rüetschi, D. Dzung, H. Vefling, A. E. Vallestad, D. Orfanus, R. Indergaard, T. Wien, and W. Merwe: “Integration Technologies for a Medium Voltage Modular Multi-Level Converter with Hot Swap Capability”, in IEEE Energy Conversion Congress and Exposition (2015)

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