Development of an integrated Bluetooth RF transceiver module using multi-layer system on package technology-Reference-Cited by-同舟云学术

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Development of an integrated Bluetooth RF transceiver module using multi-layer system on package technology

Published: Issue: Volume: Page:
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Container-title:Proceedings RAWCON 2001. 2001 IEEE Radio and Wireless Conference (Cat.No.01EX514)
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Author:

Chakraborty S.,Lim K.,Sutono A.,Chen E.,Yoo S.,Obatoyinbo A.,Laskar J.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/7535/20510/00947550.pdf?arnumber=947550

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate;Microelectronics Reliability;2016-10

2. Design and implementation of a rigid-flex RF front-end system-in-package;Microsystem Technologies;2016-09-29

3. Development of Multilayered Bandpass Filters With Multiple Transmission Zeros Using Open-Stub/Short-Stub/Serial Semilumped Resonators;IEEE Transactions on Microwave Theory and Techniques;2010-03

4. Active Antenna Module for Low-Cost Electronically Scanned Phased Arrays;IEEE Transactions on Microwave Theory and Techniques;2008-10

5. Low-temperature cofired ceramic LC filters for RF applications [Applications Notes];IEEE Microwave Magazine;2008-10

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