Author:
Wu Peng,Hou Fengze,Chen Cheng,Li Jun,Liu Fengman,Zhang Jing,Cao Liqiang,Wan Lixi
Funder
National S&T Major Project
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference32 articles.
1. RF SiP: the next wave for wireless system integration;Smolders,2004
2. "RF System in Package: Considerations, Technologies and Solutions," Chip Scale Review;Mathews,2003
3. The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade;Tummala;IEEE Trans. Adv. Packag.,2004
4. RF-SoC-expectations and required conditions;Matsuzawa;IEEE Trans.Microwave Theory Techniques,2002
5. A study on an ultra-thin PoP using through mold via technology;Yoshida,2011
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献