ShapeUp: A High-Level Design Approach to Simplify Module Interconnection on FPGAs-Reference-Cited by-同舟云学术

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ShapeUp: A High-Level Design Approach to Simplify Module Interconnection on FPGAs

Published:2010 Issue: Volume: Page:
ISSN:
Container-title:2010 18th IEEE Annual International Symposium on Field-Programmable Custom Computing Machines
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Author:

Neely Christopher,Brebner Gordon,Shang Weijia

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5473908/5474031/05474058.pdf?arnumber=5474058

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Codem: Software/Hardware Codesign for Embedded Multicore Systems Supporting Hardware Services;Reconfigurable and Adaptive Computing;2015-10-29

2. ReShape;ACM Transactions on Reconfigurable Technology and Systems;2013-05

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