Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment
Author:
Affiliation:
1. Electronics Components Technology and Materials Group, Delft University of Technology, Delft, The Netherlands
2. Chip Integration Technology Center, Nijmegen, The Netherlands
Funder
Technische Universiteit Delft
Chip Integration Technology Center
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/63/10438896/10388448.pdf?arnumber=10388448
Reference51 articles.
1. Scaling: More than Moore's law
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5. Operational reliability assessment of photovoltaic inverters considering voltage/VAR control function
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